SONY XR3F19B160
Instrukcja Serwisowa

TABLE OF CONTENTS 1. 2. DISASSEMBLY ....................................................... 3 DIAGRAMS

NOTES ON HANDLING THE OPTICAL PICKUP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. Laser Diode Properties � Material: GaAlAs � Wavelength: 780 nm � Emission Duration: continuous � Laser Output Power: less than 44.6 µW* * This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block.

2�1. Block Diagram �SERVO Section� ................................. 6 2�2. Block Diagram �MAIN Section� ................................... 7 2�3. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 8 2�4. Printed Wiring Boards �SERVO Section� ..................... 9 2�5. Schematic Diagram �SERVO Section (1/2)� ................. 10 2�6. Schematic Diagram �SERVO Section (2/2)� ................. 11 2�7. Printed Wiring Boards �MAIN Section� ....................... 12 2�8. Schematic Diagram �MAIN Section� ............................ 13 2�9. Printed Wiring Board �KEY Board� .............................. 14 2�10. Schematic Diagram �KEY Board� ................................. 14 2�11. IC Pin Function Description ........................................... 15

3. 4.

EXPLODED VIEWS ............................................... 17 ELECTRICAL PARTS LIST ................................ 21

CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Flexible Circuit Board Repairing � Keep the temperature of the soldering iron around 270 �C during repairing. � Do not touch the soldering iron on the same conductor of the circuit board. (within 3 times) � Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement � Never reuse a disconnected chip component. � Notice that the minus side of a tantalum capacitor may be damaged by heat.

SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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