TOSHIBA 55T23D
Instrukcja Serwisowa

DISASSEMBLY INSTRUCTIONS
2. REMOVAL AND INSTALLATION OF FLAT PACKAGE IC
REMOVAL 1. Put the Masking Tape (cotton tape) around the Flat Package IC to protect other parts from any damage. (Refer to Fig. 2-1.) NOTE Masking is carried out on all the parts located within 10 mm distance from IC leads.
Blower type IC desoldering machine

3. When IC starts moving back and forth easily after desoldering completely, pickup the corner of the IC using a tweezers and remove the IC by moving with the IC desoldering machine. (Refer to Fig. 2-3.) NOTE Some ICs on the PCB are affixed with glue, so be careful not to break or damage the foil of each IC leads or solder lands under the IC when removing it.

Masking Tape (Cotton Tape)

IC

Tweezers

Fig. 2-1
IC

2. Heat the IC leads using a blower type IC desoldering machine. (Refer to Fig. 2-2.) NOTE Do not add the rotating and the back and forth directions force on the IC, until IC can move back and forth easily after desoldering the IC leads completely. 4. Peel off the Masking Tape.

Fig. 2-3

5. Absorb the solder left on the pattern using the Braided Shield Wire. (Refer to Fig. 2-4.) NOTE Do not move the Braided Shield Wire in the vertical direction towards the IC pattern.

Blower type IC desoldering machine

Braided Shield Wire

Soldering Iron

IC

Fig. 2-2

IC pattern

Fig. 2-4

B2-1