|
|
|
Kategorie
|
|
Informacje
|
|
Polecamy
|
|
|
 |
|
- GENERAL
- Location of Controls
- Getting Started
- Setting the Clock
- CD Player
- Radio
- RDS
- Other Functions
- CD/MD Unit
- Connections
- DISASSEMBLY
- Cover Assy
- Front Panel Assy
- Sub Panel (1) Assy
- CD Mechanism Block
- Main Board
- Heat Sink
- Chassis (T) Sub Assy
- Lever Assy
- Servo Board
- Roller Assy
- Chassis (OP) (O/S) Assy
- Optical Pick - up Block
- ELECTRICAL ADJUSTMENTS
- DIAGRAMS
- IC Pin Description
- Block Diagram - CD Section
- Block Diagram - Main Section
- Circuit Boards Location
- Schematic Diagram - CD Mechanism Section
- Printed Wiring Boards - CD Mechanism Section
- Printed Wiring Board - Main Section
- Schematic Diagram - Main Section
- Printed Wiring Board - Display Section
- Schematic Diagram - Display Section
- EXPLODED VIEWS
- Chassis Section
- Front Panel Section
- CD Mechanism Section (1)
- CD Mechanism Section (2)
- CD Mechanism Section (3)
- ELECTRICAL PARTS LIST
Dla tego produktu nie napisano jeszcze recenzji!
 ;
Wszystko w porządku.
Instrukcja czytelna i kompletna.
Dziękuję.
all right!
thank you.
;
Bardzo dobra instrukcja. Zawiera wszystko co potrzeba, polecam!
 ;
Instrukcja jest OK. Schematy czytelne, opisane niektóre procedury.
;
Instrukcja bardzo czytelna. zawiera co potrzeba. Polecam
;
...instrukcja serwisowa w pełni czytelna i kompletna. Dziękuję!
SERVICE NOTE CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on Chip Component Replacement � Never reuse a disconnected chip component. � Notice that the minus side of a tantalum capacitor may be damaged by heat. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. NOTES ON PICK-UP FLEXIBLE BOARD The pick-up flexible board in this set is secured to the optical pick-up with an adhesive tape. Once the tape is removed, an adhering force becomes weak, and it cannot be reused. Therefore, if the optical pick-up is replaced, replace also the pick-up flexible board with a new one.
NOTES ON CLEANING THE OBJECTIVE LENS
cotton swabs objective lens
2-axis actuator
2-axis cover slide base
Apply CD lens cleaner B-4 (Part No.:J-2501-000-A) to cotton swabs (narrow type) (Part No.:J-2501-023-A) to be lightly wet. Use a force (about 5 g) to make the objective lens in contact with the bottom lightly, and clean the lens by spirals as following below. Replace the cotton swab and repeat this cleaning two or three times.
surface of objective lens
Notes: Do not force to push the objective lens. Otherwise, the plate spring supporting the objective lens will be bent, causing a deteriorated RF waveform. Never touch anything other than the objective lens. Otherwise, a significant deterioration occurs in the RF waveform.
SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
�2�
|
|
|
> |
|
