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Kto jest w sklepie?
Sklep przegląda 6043 gości
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Dla tego produktu nie napisano jeszcze recenzji!
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jedyne do czego mogę mieć zastrzeżenie to jakość zdjęć zawartych w przesłanej instrukcji serwisowej ponieważ są fatalnej jakości, praktycznie nieczytelne. tak poza tym jestem zadowolony to jest to czego szukałem.
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Wszystko w porządku.
Instrukcja czytelna i kompletna.
Dziękuję.
all right!
thank you.
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Bardzo dobra instrukcja. Zawiera wszystko co potrzeba, polecam!
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Instrukcja jest OK. Schematy czytelne, opisane niektóre procedury.
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Instrukcja bardzo czytelna. zawiera co potrzeba. Polecam
Ic DESCRIPTION-2 IC, LA9241 M
Pin No. 1 2
3
Pin Name FIN2 FIN1 E IF TB TEI TE
I/o I I I I subtracting from the F pin signal, I I I
Description Pin to which external pickup photo diode is connected. RF signal is created by adding I with the FIN1 pin signal, FE signal is created by subtracting from the FIN1 pin signal. I Pinto which external pickup photo diode is connected,
Pin No. 36 37
Pin Name TES HFL
I/o o o
Description Pin from which TES signal is output to DSP. �High Frequency Level� is used to judge whether the main beam position is on top of I bit or on top of mirror.
1
I
I
I
I
I
38
I
I
I
I
SLOF
Cv�, Cv+
I
I
I
4 5 6 7 8 9 I
I
I
I
Pin to which external pickup photo diode is connected, TE signal is created by
I
I
I I
I
Sled servo off control input pin.
I Pin to which external pickup photo diode is connected,
DC component of the TE signal is input. I Pin to which external resistor setting the TE signal gain is connected between the TE pin.
I I
39,40 41 42
I CLV error signal input pin from DSP. I RF output pin, RF gain setting and EFM signal 3T compensation constant setting pin together with 1 RFSM pin. �Slice Level Control� is the output pin which controls the RF signal data slice level by
I
RFSM RFS-
IO I 1
I I
1
I
I
o
I
TE signal output pin. TES �Track Error Sense� comparator input pin. TE signal is passed through a bandpass filter then input. Shock detection signal input pin.
I
I
43 44 45 46 47 48 49
50 51
I
I
I I
I
SLC SLI DGND FSC TBC NC DEF CLK
CL
Io I
I
I
TESI SCI
I
1 I I O
I
I DSP. Input pin which control the data slice level by the DSP. Digital system GND.
I
I Tracking gain time constant setting pin. I TA amplifier output pin. Pin to which external tracking phase compensation constants are connected between the TD and VR pins.
I I I
I I
I1I I �I
I I
I o I Output pin to which external focus search smoothing capacitor is connected.
I �Tracking Balance Control� EF balance variable range setting pin. I No connection, I Disc defect detector output pin. I Reference clock input pin. 4.23 MHz of the DSP is input.
I
I I I
I I I
12
I
TD-
I I I
I
I
I
I I
I� IO ]
I 1
-H---15 16 17
I Tracking jump signal (kick pulse) amplitude setting pin, I Tracking control signal output pin. I Focusing control signal output pin. Pin to which external focusing phase compensation constants are connected between the FD and FA pins.
Tracking phase compensation setting pin.
1 I
I I
I
Microprocessor command clock input pin.
I
I
I
I
TO FD FD-
IO IO I
52 53 54 55 56 57 58
I
DAT CE DRF FSS
VCC2
I I I I
I I
I Microprocessor command data input pin. I Microprocessor command chip enable input pin.
I
I
I
I I
I
I I
I I
o I �Detect RF� RF level detector output.
I
�
I
�Focus Search Select� focus search mode (* search/+ search) select pin. Servo system and digital system Vcc pin. Pin to which external bypass capacitor for reference voltage is connected. Reference voltage output pin.
18
FA
I
Pin to which external focusing phase compensation constants are connected between the FD� and FA� pins.
REFI VR I I I I
I
� o I I
19 20 I
FAFE I
I
Pin to which external focusing phase compensation constants are connected between the FA and FE pins.
1
I
59 60 61 62
63
LF2 PH1 BH1 LDD LDS Vccl
I Disc defect detector time constant setting pin. I Pin to which external capacitor for RF signal peak holding is connected. I Pin to which external capacitor for RF signal bottom holding is connected.
I I I I
o I FE signal output pin.
I I I I Pin to which external FE signal gain setting resistor is connected between the FE pin. Analog signal GND. No connection. � �
II
I I I
22 23
I
AGND NC
I I
o I APC circuit output pin.
I
I
I
I
I
I
APC circuit input pin.
I
I
-+-w26 27 28 29
30,31
o I Single ended output of the CV+ and CV� pin input signal.
1 I Pin to which external spindle gain setting resistor in 12 cm mode is connected.
64
I
I�
I RF system Vcc pin.
I I I
1
sPSPD SLEQ SLD
SL-, SL+
I
I
I I I
I
I
I Pin to which external spindle phase compensation constants are connected together
I with SPD pin. I Pin to which external sled phase compensation constants are connected.
o I Spindle control signal output pin.
I
I
I
o I Sled control signal output pin.
I I Sled advance signal input pin from microprocessor.
32,33 34 35
I I I
JP�, JPiTGL TOFF
1 1 I Tracking jump signal input pin from DSP.
I I I I I Tracking gain control signal input from DSP. Low gain when TGL = H. I Tracking off control signal input pin from DSP. Off when TOFF = H.
21
22
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