jedyne do czego mogę mieć zastrzeżenie to jakość zdjęć zawartych w przesłanej instrukcji serwisowej ponieważ są fatalnej jakości, praktycznie nieczytelne. tak poza tym jestem zadowolony to jest to czego szukałem.
Instrukcja bardzo czytelna. zawiera co potrzeba. Polecam
Tekstowy podgląd strony 60 (kliknij aby zobaczyć)
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1.3 Requirements for storage and baking after opening the antihumidity packaging (dry bag)
After a dry pack has been opened, all SMD packages within that bag must complete all solder reflow processing, including rework, within 168 hours (1 week), unless opened parts are stored in a dry cabinet at <10% RH. After this time, parts must be baked as per the below conditions before use. Heatproof trays (you will see clear �Heat Proof Tray� markings) are employed for some products. If the term of viability after opening the antihumidity packaging elapses during your manufacturing span, be sure to apply a baking process to the products with the heatproof tray before mounting the products. The recommended baking conditions are as follows: at 125 degrees C for 24 hours
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1.4 Analysis of nonconforming items
When you remove our semiconductor products to analyze a nonconforming item, it is recommended to remove them after baking under the conditions mentioned in 1.3 above. If you remove the product using hot air in a status where the resin has absorbed moisture, heat stress may cause package cracking or adhesion degradation of the resin, and the actual reason for nonconformity may not found easily.
