SONY ICDP110VTP
Instrukcja Serwisowa

ICD-P110VTP

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) Common Note on Schematic Diagrams: � All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. � All resistors are in � and 1/4 W or less unless otherwise specified. � % : indicates tolerance. � f : internal component. � C : panel designation. � A : B+ Line. � Power voltage is dc 3V and fed with regulated dc power supply from external power voltage jack. � Voltage and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : REC ( ) : PB � Voltages are taken with a VOM (Input impedance 10 M�). Voltage variations may be noted due to normal production tolerances. � Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. � Circled numbers refer to waveforms. � Signal path. E : PB a : REC � For CSP (chip size package), it is impossible to measure the voltage and waveforms since the package has a different outline from conventional IC�s.

� Waverforms � AUDIO board �

1

IC102 ta 4.096MHz OUT

1 Vp-p 0.5 V/DIV, 0.1 µs/DIV

� MAIN board �

1

IC702 <z/, 4.096MHz OUT

1.2 Vp-p 0.5 V/DIV, 0.1 µs/DIV

2

IC704 qd 12MHz OUT

Common Note on Printed Wiring Boards: � X : parts extracted from the component side. � Y : parts extracted from the conductor side. � f : internal component. � : Pattern from the side which enables seeing. (The other layer�s patterns are not indicated.) Caution: Pattern face side: (SIDE B) Parts face side: (SIDE A)

1.2 Vp-p 0.5 V/DIV, 0.1 µs/DIV

Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.

* A special tool is necessary to serve to IC702 used in this.
� Lead Layouts

front view

Lead layout of conventional IC

CSP (chip size package)

ICD-P110VTP

16

16