SONY ICDV21
Instrukcja Serwisowa

TABLE OF CONTENTS SERVICING NOTE ······················································ 2 1. 2. 3.
3-1. 3-2. 3-3. 3-4.

GENERAL ······································································ 3 DISASSEMBLY DIAGRAMS
IC Block Diagrams ····························································· 5 Printed Wiring Board � MAIN Section � ······················· 6 Schematic Diagram � MAIN Section � ·························· 9 IC Pin Functions ······························································· 12

2-1. MAIN board ······································································· 4

4. 5.

EXPLODED VIEWS ·················································· 15 ELECTRICAL PARTS LIST ··································· 16

SERVICE NOTE
Notes on chip component replacement � Never reuse a disconnected chip component. � Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing � Keep the temperature of soldering iron around 270 �C during repairing. � Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). � Be careful not to apply force on the conductor when soldering or unsoldering.

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