PANASONIC KX-TG8231B
Instrukcja Serwisowa

KX-TG8231B/KX-TG8232B/KX-TGA820B

9.5.
9.5.1.

How to Replace the LLP (Leadless Leadframe Package) IC
Preparation

� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)

9.5.2.

Caution

� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

9.5.3.

How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P. C. board.

2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.

3. After removing the IC, clean the P. C. board of residual solder.

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