jedyne do czego mogę mieć zastrzeżenie to jakość zdjęć zawartych w przesłanej instrukcji serwisowej ponieważ są fatalnej jakości, praktycznie nieczytelne. tak poza tym jestem zadowolony to jest to czego szukałem.
Instrukcja jest OK. Schematy czytelne, opisane niektóre procedury.
Tekstowy podgląd strony 51 (kliknij aby zobaczyć)
KX-TG8231B/KX-TG8232B/KX-TGA820B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
