jedyne do czego mogę mieć zastrzeżenie to jakość zdjęć zawartych w przesłanej instrukcji serwisowej ponieważ są fatalnej jakości, praktycznie nieczytelne. tak poza tym jestem zadowolony to jest to czego szukałem.
Instrukcja bardzo czytelna. zawiera co potrzeba. Polecam
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PT3-E/G AVC3-U
General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range 500°F to 600°F. 2. Use an appropriate gauge of resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well-tinned. 4. Thoroughly clean the surfaces to be soldered. Use a small wire-bristle (0.5 inch or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following desoldering technique. a. Allow the soldering iron tip to reach normal temperature (500°F to 600°F). b. Heat the component lead until the solder melts. Quickly draw away the melted solder with an antistatic, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach normal temperature (500°F to 600°F). b. First, hold the soldering iron tip and solder strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil or components. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to areas.) �Small-signal� Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a �U� shape the end of each of the three leads remaining on the circuit board. 3. Bend into a �U� shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the �U� with long nose pliers to insure metal to metal contact, then solder each connection. Power Output Transistor Devices Removal/Replacements 1. Heat and remove all solder from around the transistor leads. 2. Remove the heatsink mounting screw (if so equipped). 3. Carefully remove the transistor from the circuit board. 4. Insert new transistor in circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heatsink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicularly to the circuit board.
Use Soldering Iron to Pry Leads
Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suctiontype solder removal device (or with solder braid) before removing the IC.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two �original leads�. If they are not shiny, reheat them and, if necessary, apply additional solder.
IC Removal/Replacement Some Hitachi unitized chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
