FUNAI 6432TFY
Instrukcja Serwisowa

3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.

With Soldering Iron: 1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

CBA

Hot-air Flat Pack-IC Desoldering Machine

Flat Pack-IC

Desoldering Braid

Soldering Iron Masking Tape Tweezers Flat Pack-IC Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by

Fig. S-1-2

one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)

Sharp Pin Fine Tip Soldering Iron

Fig. S-1-4

3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) 4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)

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